Smooth copper foil / low dielectric material bonding service
Joining of inorganic and organic materials using molecular adhesives.
Our company specializes in the bonding of smooth copper foil and low dielectric materials. This is suitable for high-frequency substrates required in the ICT market and can be adapted to low dielectric resins (such as LCP and PPE). Please feel free to consult us if you have any requests. 【Features】 ■ Bonding of smooth copper foil is possible → Reduction of conductor loss ■ Bonding with low dielectric materials is possible → Reduction of dielectric loss ■ Bonding through chemical bonding → Improved heat resistance and durability *For more details, please download the PDF or feel free to contact us.
- Company：いおう化学研究所
- Price：Other
